Packaging Engineer

Cambridge GaN Devices

Cambridge, United Kingdom

3 weeks ago

Job Type: Permanent
Work Location: On-site
Posted: 13 Apr 2026 (3 weeks ago)

Save job

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Job Type: Permanent
Work Location: On-site
Posted: 13 Apr 2026 (3 weeks ago)

Save job

Create job alert

Packaging Engineer (GaN)

Team –R&D Engineering

Location –Cambridge, UK

Contract –Full-time, Permanent

About CGD

Making Sustainable Power Electronics Possible

A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.

The global power semiconductor market is expected to exceed $50BN. In addition to the multi-million seed fund and Series A and now B private investments, CGD has so far successfully secured four projects funded by iUK, BEIS and EU (Penta). The technical and commercial expertise of the CGD team combined with an extensive track record in the power electronics market has been fundamental in early market traction of our proprietary technology.

Bringing Innovation into Everyday Life

The environmental need for solutions to resolve the world’s most significant challenges (energy consumption and CO2 emissions) inspires us to contribute to society by preserving nature with energy-efficient power solutions.

With a mindset on pushing the limits of semiconductor (GaN) properties and an outstanding team of worldwide experts leveraging knowledge, IP, and decades of research, we demonstrate technological advancement by developing green solutions for everyday electronics, respecting our planet’s natural resources, and creating a more sustainable future for the generations to come.

Why Work for CGD

We Champion Commitment, Celebrate Empowerment, and Reward the Brave.

We are interested in change-makers with a passion for power semiconductors who are willing to explore unconventional ways to meet the company’s green agenda.

At CGD, we pride ourselves on putting empowerment and commitment at the core of our company culture. We offer a relaxed yet productive working environment where everybody is valued and respected and becomes part of commercial success while experiencing professional growth.

If your heart beats for innovation, challenge, and growth, and if the prospect of joining a friendly and game-changing company is for you, we want to hear from you.

The Opportunity

CGD is now looking for a Packaging Engineer to join our growing engineering team. Reporting directly to the Director of Engineering, this is an amazing opportunity to join CGD at an early stage and help drive the packaging solutions for CGD’s GaN power products.

The Engineer will be responsible for supporting the technical development of high performance and high-density semiconductor packaging solutions for CGD internal product development and public funded projects. This role will work closely with the GaN chip design team in R&D Engineering (design process), with the Operations team (packaging supply chain and support product qualification tests), and the Application Engineering team (to satisfy customers’ package requirements).

The role is based in the Cambridge headquarters but may also require the post holder to travel globally to subcontractors, partners and customers.

Main Responsibilities

Reporting directly to the Director of Engineering, the Engineer will be responsible for:

Working on the technical development of high performance and high-density semiconductor packaging solutions for CGD GaN power products
Working closely with both internal (e.g. GaN chip design team, Application Engineering team, Operations team) and external (e.g. packaging partners) stakeholders, both in the UK and overseas
Surveying market for suitable packaging technologies in support of CGD product roadmap
Supporting package technology developments with suppliers to differentiate CGD products
Conducting multiphysics simulations (finite element modelling) to analyse package and system level thermal performance, parasitic extraction, current spreading, electromagnetic fields and thermo-mechanical stress of CGD’s GaN power packages
Assisting with the design of wirebond, flip chip and embedded semiconductor packages, including wafer back-end process modifications, to meet the product goals in terms of form factor as well as electrical and thermal performance
Contributing to the development and enhancements of the design process, tools and methodologies to streamline the design flow for right first-time solutions
Supporting semiconductor packaging verification and qualification tests, including driving the package related performance tests such as board level reliability, thermal characterisation etc
Conducting first article inspection and failure analysis in the labs in Cambridge as well as with external partners
Supporting the Applications Engineering team and customers by providing packaging related resources such as package outline drawings, thermal models, PCB footprints, application notes and technical support

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